Layer（Maximum）
 2-18
 20-30
 
Board material type
 FR-4, Ceramic substrate board，Aluminum based board,、High-Tg
 PTFE，PPO ，PPE
 
Rogers, etc
 E-65，etc.
 
Compound material lamination
 4layer—6layer
 6 layer—8layer
 
Maximum dimension
 610mm X 1100mm
 
 
Dimension tolerance
 ±0.13mm
 ±0.10mm
 
Board thickness coverage
 0.2mm--6.00mm
 0.20mm--8.00mm
 
Board thickness tolerance ( t≥0.8mm)
 ±8%
 ±5%
 
Board thickness tolerance(t＜0.8mm)
 ±10%
 ±8%
 
DK thickness
 0.076mm--6.00mm
 0.076mm--0.100mm
 
Min line width
 0.10mm
 0.075mm
 
Min line space
 0.10mm
 0.075mm
 
Out layer copper thickness
 8.75um--175um
 8.75um--280um
 
Inner layer copper thickness
 17.5um--175um
 8.75um--175um
 
Drilling hole diameter (Mechanical drill)
 0.25mm--6.00mm
 0.15mm--0.25mm
 
Finished hole diameter (Mechanical drill)
 0.20mm--6.00mm
 0.10mm--0.20mm
 
Hole diameter tolerance4 (Mechanical drill)
 0.05mm
 
 
Hole position tolerance (Mechanical drill)
 0.075mm
 0.050mm
 
Laser drill hole size
 0.10mm
 0.075mm
 
Board thickness and hole diameter ratio
 10:1
 12:1
 
Solder mask type
 GGreen、Yellow、Black、Purple、Blue、White, Red
 
 
Minimum Solder Mask Dam
 0.10mm
 0.075mm
 
Minimum size of solder mask separation ring
 0.05mm
 0.025mm
 
Solder mask oil plug hole diameter
 0.25mm--0.60mm
 0.60mm-0.80mm
 
Impedance control tolerance
 ±10%
 ±5%
 
Surface finish
 Hot Air Level、ENIG、Immersion silver、Gold plating, Immersion tin、Gold Finger
 Immersion Tin，OSP